| 摘要 |
<p>A semiconductor device is closely attached to a cooler with a simple structure, without torque management. Therefore, it is possible to reduce contact thermal resistance, external dimensions, and manufacturing costs. A semiconductor device (100) includes a terminal case (1), a beam portion (4) which has elasticity and is connected to the terminal case (1), divided insulating substrates with a conductive pattern (5), a fastener (7) which is disposed at the center of the terminal case (1), and an elastic sealing resin (8) which fills the terminal case (1). According to the semiconductor device (100), it is possible to improve adhesion to a cooler and to reduce contact thermal resistance. Since a plurality of divided insulating substrates (5) with a conductive pattern are provided, they can be closely attached to the cooler. In addition, it is possible to simply attach the semiconductor device to the cooler only by inserting a hook portion (7b) provided at the leading end of the fastener (7) into a two-stage hole of the cooler. The attachment does not require torque management required in a screwing operation and it is possible to provide a semiconductor device at a low cost.</p> |
