| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a division method of a wafer, which does not damage a device on a surface side of the wafer. <P>SOLUTION: A recess 10a in a size equivalent to a device region Wa of a wafer W is formed in a support member 1, the device region Wa of the wafer W is confronted with the recess 10a so as to bond an outer periphery surplus region Wb of the wafer W to an outer peripheral portion 10b of the support member 1. Thus, the device region Wa is held without bringing it into contact with the support member 1. The wafer is divided into devices in such a state, and the support member 1 is peeled from the wafer. Thus, the device can be prevented from being damaged when the wafer is peeled from the support member. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
