| 摘要 |
An object is to realize a laser processing apparatus and a laser processing method with which a thick processed object can be cut using short-wavelength laser light. A laser processing apparatus (10) irradiates a processed object (12) with YAG-based laser light focused by a first irradiation unit (14) and radiates CO 2 laser light having a longer wavelength than the YAG-based laser light and focused by the second irradiation unit (16) onto a region of the processed object (12) being irradiated with the YAG-based laser light. In other words, the YAG-based laser light melts the metal forming the processed object (12), and the CO 2 laser light, having a higher plasma absorptance than the YAG-based laser light, increases the temperature of the molten metal. As a result, the molten metal reaches a high temperature, and the viscosity of the molten metal can be sufficiently reduced for the molten metal to be blown away by assist gas. |
