发明名称 |
Thermally conductive resin composition and thermally conductive sheet including the same |
摘要 |
A thermally conductive resin composition containing (A1) a fluorine-based compound having one to two terminal SiH group(s), in which a content of molecules having two such groups is 60 to 100 mole %, (B1) a fluorine-based compound having one to two terminal alkenyl group(s), in which a content of molecules having two such groups is 60 to 100 mole %, (A2) a fluorine-based compound in which a content of molecules having two terminal SiH groups is 0 to 40 mole %, (B2) a fluorine-based compound in which a content of molecules having two terminal alkenyl groups is 0 to 40 mole %, and (C) a thermally conductive filler, and satisfying, in connection with the content of the fluorine-based compounds, relation of [(A1)+(B1)]/[(A2)+(B2)]=20/80 to 80/20, (A1)/(B1)=20/80 to 80/20, and (A2)/(B2)=20/80 to 80/20, as well as a thermally conductive sheet including the same are provided. |
申请公布号 |
US8912278(B2) |
申请公布日期 |
2014.12.16 |
申请号 |
US201313826255 |
申请日期 |
2013.03.14 |
申请人 |
Nippon Valqua Industries, Ltd. |
发明人 |
Imada Hirohisa |
分类号 |
C08G77/06 |
主分类号 |
C08G77/06 |
代理机构 |
Roylance, Abrams, Berdo & Goodman, L.L.P. |
代理人 |
Roylance, Abrams, Berdo & Goodman, L.L.P. |
主权项 |
1. A thermally conductive resin composition, comprising:
(A1) a fluorine-based compound having a perfluoroalkyl ether structure in a main chain and one to two hydrosilyl group(s) at molecule terminal of main chain, in which a content of molecules having two hydrosilyl groups is 60 to 100 mole %; (B1) a fluorine-based compound having a perfluoroalkyl ether structure in a main chain and one to two alkenyl group(s) at molecule terminal of main chain, in which a content of molecules having two alkenyl groups is 60 to 100 mole %; (A2) a fluorine-based compound having a perfluoroalkyl ether structure in a main chain and one to two hydrosilyl group(s) at molecule terminal of main chain, in which a content of molecules having two hydrosilyl groups is 0 to 40 mole %; (B2) a fluorine-based compound having a perfluoroalkyl ether structure in a main chain and one to two alkenyl group(s) at molecule terminal of main chain, in which a content of molecules having two alkenyl groups is 0 to 40 mole %; and (C) a thermally conductive filler, said thermally conductive resin composition satisfying, in connection with the content of said fluorine-based compounds (A1), (B1), (A2), and (B2), following Equations [1] to [3]
[(A1)+(B1)]/[(A2)+(B2)]=20/80 to 80/20 by weight [1](A1)/(B1)=20/80 to 80/20 by weight [2](A2)/(B2)=20/80 to 80/20 by weight [3] said fluorine-based compounds (A1), (B1), (A2), and (B2) have a main chain structure expressed with following Formula [6](where n is an integer from 1 to 10). |
地址 |
Tokyo JP |