Mounting apparatus

摘要

The purpose of the invention is to provide a mounting apparatus that can mount a part such as a chip, etc. on a substrate effectively and precisely. A wafer is placed on the upper surface of turntable, which has opening section, and a backup section and a head section that hold a chip are lifted up and lowered respectively, at opening section. The wafer and the chip are contacted, pinched and held locally, and then they are heat-bonded. After that, the backup section and the head section are removed. Lift arms equipped on a holding table are inserted between the wafer and turntable, the wafer is lifted up, and opening section is moved relative to the wafer when turntable is rotated. The wafer is placed on turntable again and the bonding process is performed.

主权项

1. A mounting apparatus for mounting an object-to-be-mounted on a substrate, said mounting apparatus comprising:
a holding pedestal which has an opening section on a portion of the holding pedestal, the substrate being placed on at least a portion of the peripheral of the opening section of an upper surface of the holding pedestal; a holding section that holds the substrate so that the holding pedestal can be moved relative to the substrate; a drive mechanism that moves the holding pedestal so that the opening section is moved relative to the substrate under a condition that the substrate is being held by the holding section, a backup section positioned under the holding pedestal so that the backup section contacts a bottom surface of the substrate locally through the opening section; and a head section that pinches the substrate and the object-to-be-mounted against the backup section at a position where the backup section contacts a bottom surface of the substrate,
an area of the opening section of the holding pedestal being smaller than an entire area of the substrate, and the opening section being moved by the drive mechanism so that an area of a track of the opening section becomes larger than the area of the substrate at a place where the substrate is included.