Method of attaching an electronic device to an MLCC having a curved surface

摘要

A method of forming an electrical component is provided. The method comprises preparing a subassembly by electrically connecting an integrated circuit to a flexible circuit; and attaching the subassembly to a multilayer ceramic capacitor having a mounting surface with a curvature deviation exceeding 0.008 inches per inch.

主权项

1. A method of forming an electrical connection comprising:
providing a capacitor wherein said capacitor has a mounting surface with a curvature deviation exceeding 0.008 inches per inch; providing an electronic component; forming a conductive column comprising conductive balls between said capacitor and said electronic component wherein said conductive column has a height which is at least as large as a sum of said curvature deviation, a stand-off distance between said capacitor and said electronic component and a compression distance; and bonding said capacitor to said electronic component through said conductive column.