Deposition ring and electrostatic chuck for physical vapor deposition chamber

摘要

Embodiments of the invention generally relate to a process kit for a semiconductor processing chamber, and a semiconductor processing chamber having a kit. More specifically, embodiments described herein relate to a process kit including a deposition ring and a pedestal assembly. The components of the process kit work alone, and in combination, to significantly reduce their effects on the electric fields around a substrate during processing.

主权项

1. A deposition ring for use in a substrate processing chamber, comprising:
a first cylinder having a first end and a second end, remaining surfaces of the deposition ring disposed below the first end, wherein an outer diameter of the first cylinder and the first end of the first cylinder intersect at a notch; a first annular ring comprising:
an inner diameter;an outer diameter;a top surface; anda bottom surface opposite the top surface, wherein the first annular ring is coupled to the second end of the first cylinder by a portion of the top surface adjacent the inner diameter of the first annular ring such that the first end extends above and away from the top surface of the first annular ring; a second cylinder coupled at a first end to a portion of the bottom surface adjacent the outer diameter of the first annular ring; and a second annular ring comprising:
an inner diameter;an outer diameter;a top surface including a raised annular outer pad adjacent the outer diameter of the second annular ring and a raised annular inner pad disposed radially inward of the raised annular outer pad, the raised annular inner pad separated from the raised annular outer pad by a groove; anda bottom surface opposite the top surface, wherein a portion of the top surface adjacent the inner diameter of the second annular ring is coupled to a second end of the second cylinder opposite the first end such that the top surface of the second annular ring is below and radially outward of the top surface of the first annular ring, and wherein a distance between the first and second ends of the first cylinder is at least a third of a distance between the first end of the first cylinder and the bottom surface of the second annular ring, and wherein the top surface, the outer diameter and bottom surface of the second annular ring meet to define an outer edge of the deposition ring.