Interfacing between an integrated circuit and a waveguide through a cavity located in a soft laminate

摘要

A low-loss interface between a mm-wave integrated circuit and a waveguide comprises a surface having a contact location for said integrated circuit and a waveguide location for fixing a waveguide thereon; a transmission line extending along said surface from said contact location to the waveguide location and extending into the waveguide location as a waveguide feed; and a connection bump on a surface of the mm-wave integrated circuit. The mm-wave integrated circuit RFIC is connected to the surface at the contact location through the connection bump, such as to connect a signal output of the RFIC to the transmission line, thereby providing said low loss interface.

主权项

1. A device comprising:
a low loss substrate comprising, on a first side, a contact location for a mm-wave integrated circuit, and on a second side, a waveguide location; a planar transmission line extending along said first side from said contact location to above said waveguide location as a monopole waveguide feed; wherein the planar transmission line including said monopole waveguide feed extends along a single planar conducting layer; connection bumps configured to connect said mm-wave integrated circuit to said low loss substrate at said contact location; a soft laminate comprising a second cavity located below the waveguide location; the second cavity configured to receive a wave transmission from the waveguide feed and forward said wave transmission to a waveguide located below the second cavity; and a back-short located essentially above the waveguide location; the back-short comprises a first cavity of depth equivalent to about a quarter wave-length, and is configured to reflect energy into said waveguide.