Three dimensional flip chip system and method

摘要

Solder is simultaneously transferred from a mold to a plurality of 3D assembled modules to provide solder bumps on the modules. The mold includes cavities containing injected molten solder or preformed solder balls. A fixture including resilient pressure pads and vacuum lines extending through the pads applies pressure to the modules when they are positioned on the mold. Following reflow and solder transfer to the modules, the fixture is displaced with respect to the mold. The modules, being attached to the fixture by vacuum pressure through the pads, are displaced from the mold with the fixture.

主权项

1. A method comprising:
attaching an interposer wafer to a glass handler; providing first solder bumps on the interposer wafer; dicing the glass handler and attached interposer wafer to form a plurality of assembly modules, each assembly module comprising a portion of the glass handler and one of the interposer wafer portions; mounting the assembly modules to a top chip wafer such that a plurality of the interposer wafer portions are attached and electrically connected to a top surface of the top chip wafer; detaching the glass handler portions from the interposer wafer portions; dicing the top chip wafer between the interposer wafer portions, thereby forming a plurality of discrete electronic modules, each electronic module comprising a portion of the top chip wafer and an interposer wafer portion; providing an assembly including a plurality resilient contact pads; providing a mold including a plurality of cavities, each of the cavities containing solder; aligning a plurality of the electronic modules on the mold such that the interposer wafer portions of the modules overlay the cavities; simultaneously exerting pressure on each of the electronic modules in the direction of the mold, the step of simultaneously exerting pressure on each of the electronic modules in the direction of the mold including urging the resilient contact pads against the electronic modules; reflowing the solder within the cavities while pressure is exerted on the electronic modules; causing the solder to be transferred to and form second solder bumps on the interposer wafer portions of the electronic modules, and separating the plurality of electronic modules simultaneously from the mold, the step of separating the plurality of electronic modules from the mold further including forming vacuum seals between the resilient contact pads and the electronic modules, wherein vacuum pressure is exerted on the electronic modules through the resilient contact pads to attach the electronic modules to the assembly.