发明名称 |
CCL and method of manufacturing the same |
摘要 |
There is provided a copper clad laminate (CCL) including: a metal plate; an insulating layer having a planar area greater than that of the metal plate and laminated on the metal plate; and a copper layer laminated on the insulating layer, wherein edges of the insulating layer extend outwardly beyond edges of the metal plate so that an insulation distance insulating the edges of the metal plate from edges of the copper layer is formed. The insulating layer may include a polyimide layer, and a polyimide bonding layer. |
申请公布号 |
US8911848(B2) |
申请公布日期 |
2014.12.16 |
申请号 |
US201213681872 |
申请日期 |
2012.11.20 |
申请人 |
Samsung Electronics Co., Ltd. |
发明人 |
Kim Young Kyung |
分类号 |
H05K1/05;H05K3/00;H05K3/02 |
主分类号 |
H05K1/05 |
代理机构 |
F. Chau & Associates, LLC |
代理人 |
F. Chau & Associates, LLC |
主权项 |
1. A copper clad laminate (CCL) comprising:
a metal plate; an insulating layer on the metal plate and having a planar area greater than that of the metal plate; and a copper layer on the insulating layer, wherein edges of the insulating layer and edges of the copper layer extend outwardly beyond edges of the metal plate so that an insulation distance which electrically insulates the edges of the metal plate from the edges of the copper layer is formed. |
地址 |
Suwon-si, Gyeonggi-do KR |