Method of manufacturing a film bulk acoustic resonator with a loading element

摘要

Manufacturing a semiconductor structure including modifying a frequency of a Film Bulk Acoustic Resonator (FBAR) device though a vent hole of a sealing layer surrounding the FBAR device.

主权项

1. A method of manufacturing a semiconductor structure, comprising:
forming a bottom electrode of a Film Bulk Acoustic Resonator (FBAR) device on a first sacrificial material and an insulator layer; forming a piezoelectric material on the bottom electrode; forming a top electrode of the FBAR device on the piezoelectric material; forming a loading element on the top electrode; forming a second sacrificial material on and surrounding the FBAR device; forming a sealing layer on the insulator layer and the second sacrificial material; forming a vent hole in the sealing layer; selectively removing the first sacrificial material and the second sacrificial material using an etch process through the vent hole, without removing the loading element; and modifying a frequency of the FBAR device through the vent hole of the sealing layer surrounding the FBAR device, wherein the modifying a frequency is performed after the forming the sealing layer and after the selectively removing the first sacrificial material and the second sacrificial material.