发明名称 Semiconductor device with strained channel and method of fabricating the same
摘要 A semiconductor device includes: a gate pattern over a substrate; recess patterns provided in the substrate at both sides of the gate pattern, each having a side surface extending below the gate pattern; and a source and a drain filling the recess patterns, and forming a strained channel under the gate pattern.
申请公布号 US8912068(B2) 申请公布日期 2014.12.16
申请号 US201213560577 申请日期 2012.07.27
申请人 Hynix Semiconductor Inc. 发明人 Lee Young-Ho;Jeon Seung-Joon;Ahn Tae-Hang
分类号 H01L21/336;H01L29/78;H01L29/66;H01L29/165;H01L29/08 主分类号 H01L21/336
代理机构 Lowe Hauptman & Ham, LLP 代理人 Lowe Hauptman & Ham, LLP
主权项 1. A method for fabricating a semiconductor device, the method comprising: forming a gate pattern over a substrate; etching the substrate at both sides of the gate pattern to form recess patterns each having a side surface extending below the gate pattern; forming a source and a drain by respectively filling the recess patterns using epitaxial growth; and forming a protection layer over a surface of the recess pattern through an epitaxial growth before forming the source and the drain, wherein the protection layer comprises a material having a lattice constant equal to that of the substrate.
地址 Icheon-Si, Gyeonggi-Do KR