发明名称 |
Semiconductor device with strained channel and method of fabricating the same |
摘要 |
A semiconductor device includes: a gate pattern over a substrate; recess patterns provided in the substrate at both sides of the gate pattern, each having a side surface extending below the gate pattern; and a source and a drain filling the recess patterns, and forming a strained channel under the gate pattern. |
申请公布号 |
US8912068(B2) |
申请公布日期 |
2014.12.16 |
申请号 |
US201213560577 |
申请日期 |
2012.07.27 |
申请人 |
Hynix Semiconductor Inc. |
发明人 |
Lee Young-Ho;Jeon Seung-Joon;Ahn Tae-Hang |
分类号 |
H01L21/336;H01L29/78;H01L29/66;H01L29/165;H01L29/08 |
主分类号 |
H01L21/336 |
代理机构 |
Lowe Hauptman & Ham, LLP |
代理人 |
Lowe Hauptman & Ham, LLP |
主权项 |
1. A method for fabricating a semiconductor device, the method comprising:
forming a gate pattern over a substrate; etching the substrate at both sides of the gate pattern to form recess patterns each having a side surface extending below the gate pattern; forming a source and a drain by respectively filling the recess patterns using epitaxial growth; and forming a protection layer over a surface of the recess pattern through an epitaxial growth before forming the source and the drain, wherein the protection layer comprises a material having a lattice constant equal to that of the substrate. |
地址 |
Icheon-Si, Gyeonggi-Do KR |