Dicing-free LED fabrication

摘要

Provided is a method of fabricating a light-emitting diode (LED) device. The method includes providing a substrate having opposite first and second sides. A semiconductor layer is formed on the first side of the substrate. The method includes forming a photoresist layer over the semiconductor layer. The method includes patterning the photoresist layer into a plurality of photoresist components. The photoresist components are separated by openings. The method includes filling the openings with a plurality of thermally conductive components. The method includes separating the semiconductor layer into a plurality of dies using a radiation process that is performed to the substrate from the second side. Each of the first regions of the substrate is aligned with one of the conductive components.

主权项

1. A method, comprising:
providing a substrate having opposite first and second sides, wherein the first side has a semiconductor layer formed thereon; forming a photoresist layer over the semiconductor layer such that an entire portion of a bottom surface of the photoresist layer is formed on a top surface of the semiconductor layer; patterning the photoresist layer into a plurality of photoresist components, the photoresist components being separated by openings; filling the openings with a plurality of conductive components; and separating the semiconductor layer into a plurality of dies using a radiation process that includes selectively radiating a plurality of first regions of the substrate from the second side, each of the first regions of the substrate being aligned with a respective one of the conductive components.