Operating method of hardwired switch

摘要

An operating method of a hardwired switch is provided. First, a first die is provided. The first die is configured as the first die in the hardwired switch. Next, a function of the first die is inspected to obtain an inspected result. Upon the inspected result, whether a second TSV is selectively disposed between the first landing pad and the fifth landing pad, between the second landing pad and the sixth landing pad, between the third landing pad and the seventh landing pad, or between the fourth landing pad and the eighth landing pad or not is determined. The first die is stacked above a second die, so that the second surface is located between the first die and the second die.

主权项

1. An operating method of a hardwired switch, comprising:
providing a first die; inspecting a function of the first die to obtain an inspected result; determining whether a first through silicon via is selectively disposed between a first landing pad and a fifth landing pad, between a second landing pad and a sixth landing pad, between a third landing pad and a seventh landing pad, or between a fourth landing pad and a eighth landing pad or not upon the inspected result, wherein the first landing pad, the second landing pad, the third landing pad the fourth landing pad are disposed on a first surface of the first die, and the fifth landing pad, the sixth landing pad, the seventh landing pad and the eighth landing pad are disposed on a second surface of the first die; disposing a third bond pad on the second surface, wherein the third bond pad is electrically connected to the fifth landing pad; disposing a fourth bond pad on the second surface, wherein the fourth bond pad is electrically connected to the seventh landing pad; disposing a fifth bond pad on a third surface of the second die, wherein the fifth bond pad is located at a relative position of the third bond pad; disposing a sixth bond pad on the third surface, wherein the sixth bond pad is located at a relative position of the fourth bond pad; and stacking the first die above the second die, so that the second surface and the third surface are located between the first die and the second die, wherein the fifth bond pad is electrically connected to the third bond pad, and the sixth bond pad is electrically connected to the fourth bond pad.