Method for attaching a metal surface to a carrier, a method for attaching a chip to a chip carrier, a chip-packaging module and a packaging module

摘要

A method for attaching a metal surface to a carrier is provided, the method including: forming a first polymer layer over the metal surface; forming a second polymer layer over a surface of the carrier; and bringing the first polymer layer into physical contact with the second polymer layer such that at least one of an interpenetrating polymer structure and an inter-diffusing polymer structure is formed between the first polymer layer and the second polymer layer.

主权项

1. A chip-packaging module comprising:
a chip and a chip carrier; a metal surface formed over a surface of the chip; a first polymer layer, having a thickness of 20 μm or less, formed over the metal surface; a second polymer layer formed over a surface of the chip carrier; and at least one of an interpenetrating polymer structure and an inter-diffusing polymer structure formed of the first polymer layer and the second polymer layer.