The present invention relates to a printed circuit board (PCB) including: an insulation substrate; a cooper foil pattern layers and insulation adhesive sheets which are sequentially laminated on the upper and lower sides of the insulation substrate; an inductor included in the upper copper foil pattern layer; a ground unit which is included on the lower copper foil pattern layer; and a single penetration hole which penetrates the substrate and the insulation adhesive sheets. The single penetration hole is located between the inductor and the ground unit.
