Leadless multi-chip module structure

摘要

Multi-chip quad flat no-lead (QFN) packages and methods for making the same are disclosed. A multi-chip package may include a first die including a plurality of first bond pads, wherein selected first bond pads are wire-bonded to a first side of a leadframe, and a second die mounted on the first die and including a plurality of second bond pads, wherein selected second bond pads are wire-bonded to a second side, opposite the first side, of the leadframe. Another package may include a first die including a plurality of first bond pads, wherein selected first bond pads are wire-bonded to a first side of a leadframe, and a second die flip-chip mounted on a second side of the leadframe and including a plurality of second bond pads, wherein selected second bond pads are bonded to the second side of the leadframe. Other embodiments are also described.

主权项

1. A semiconductor device comprising:
a leadframe; a first die including a first bond pad, wherein the first bond pad of the first die is wire-bonded to a first side of the leadframe via a first bond wire, wherein the first die has (i) a first side and (ii) a second side that is opposite the first side of the first die, wherein the first bond pad is disposed on the first side of the first die; a second die, wherein (i) a first section of the second die is mounted on a second side of the leadframe and (ii) a second section of the second die is over the first die, wherein the second side of the leadframe is opposite to the first side of the leadframe; a mold compound encapsulating (i) the first bond wire, and (ii) the first side of the first die; and an underfill material formed (i) between the second section of the second die and the second side of the first die, and (ii) between the first section of the second die and the second side of the leadframe, wherein the underfill material is different from the mold compound.