Low profile electronic package and associated methods

摘要

An electronic package includes a printed wiring board (PWB) having a die-receiving cavity therein, a semiconductor die in the die-receiving cavity and coupled to the PWB, and a lid mating ring at an upper surface of the PWB surrounding the die-receiving cavity. The lid mating ring has spaced apart pillar-receiving openings therein. A lid is coupled to the lid mating ring and covers the semiconductor die within the die-receiving cavity. The lid includes a liquid crystal polymer (LCP) layer, and spaced apart pillars extending downwardly from a lower surface of the LCP layer and received in corresponding ones of the spaced apart pillar-receiving openings.

主权项

1. An electronic package comprising:
a printed wiring board (PWB) having a die-receiving cavity therein; a semiconductor die in the die-receiving cavity and coupled to said PWB; a lid mating ring at an upper surface of said PWB surrounding the die-receiving cavity, said lid mating ring having a plurality of spaced apart pillar-receiving openings therein; and a lid coupled to said lid mating ring and covering said semiconductor die within the die-receiving cavity, said lid comprising
a liquid crystal polymer (LCP) layer, anda plurality of spaced apart pillars extending downwardly from a lower surface of said LCP layer and received in corresponding ones of said plurality of spaced apart pillar-receiving openings.