发明名称 WOODY FLOOR MATERIAL AND FLOOR STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a direct bonding woody floor material excellent in sound insulation performance.SOLUTION: An inventive woody floor material constructed by direct bonding includes: a plywood base material layer 1 constituted of a plywood in which a plurality of veneer sheets 11-15 are laminated; a decorative surface layer 2 provided on the front side of the plywood base material layer 1; and a sound insulation layer 3 provided on the back side of the plywood base material layer 1. A plurality of rear grooves 4 extended in a floor material width direction and opened on the back side are formed at intervals in a floor material lengthwise direction in the plywood base material layer 1. An upper end position of the rear groove is arranged in the second veneer sheet 12 from the top in the plywood base material layer 1. Among the plurality of veneer sheets 11-15 constituting the plywood base material layer, the thickness of the first veneer sheet 11 is set to be 0.2 mm-0.8 mm. A sound insulation layer 3 is constituted of at least any one of a synthetic resin foam and a synthetic fiber nonwoven fabric, and the thickness of the sound insulation layer 3 is set to be 2 mm-6 mm.
申请公布号 JP2014234662(A) 申请公布日期 2014.12.15
申请号 JP20130117576 申请日期 2013.06.04
申请人 ASAHI WOODTEC CORP 发明人 ARAKAWA MASAHIRO;KASAI TAKESHI
分类号 E04F15/04 主分类号 E04F15/04
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