发明名称 IMAGING ELEMENT COOLING STRUCTURE
摘要 <p>PROBLEM TO BE SOLVED: To provide an imaging element cooling structure to efficiently cool an imaging element without radially enlarging a tip end of an insertion portion.SOLUTION: An imaging element package 12 is mounted on an imaging element packaging circuit board 13. A cable attachment part 21 is provided on the opposite side of the imaging element packaging circuit board 13 to the side on which the imaging element package 12 is mounted. Each cable of a composite cable 15 is joined to a land provided on a side surface of the cable attachment part 21. A flow channel is formed within a substrate cooling part 27 of the cable attachment part 21, and an inlet port and an outlet port of the flow channel are arranged on a surface on the composite cable 15 side. A coolant supply tube 25 and a coolant discharge tube 26 are disposed within the composite cable 15. The coolant supply tube 25 and the coolant discharge tube 26 are connected to the inlet port and the outlet port of the substrate cooling part 27 to circulate the coolant.</p>
申请公布号 JP2014233584(A) 申请公布日期 2014.12.15
申请号 JP20130118786 申请日期 2013.06.05
申请人 HOYA CORP 发明人 KOSHI ATSUSHI
分类号 A61B1/04;A61B1/00;G02B23/24 主分类号 A61B1/04
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