发明名称 SUBSTRATE INSPECTION METHOD, SUBSTRATE INSPECTION DEVICE, AND SUBSTRATE INSPECTION JIG
摘要 PROBLEM TO BE SOLVED: To provide an efficient substrate inspection jig which is used when performing electrical inspection of a wiring pattern formed on a substrate incorporating electronic components.SOLUTION: A substrate inspection jig electrically connects a substrate inspection device for inspecting a plurality of wiring patterns formed on a substrate incorporating electronic components to the substrate. The substrate inspection jig includes: a holding body having a plurality of contact pieces the one end of each of which comes in contact with an inspection point provided on the wiring pattern, an electrode body in contact with the other end of each of the contact pieces and having an electrode part electrically connected to the substrate inspection device, an inspection-side holding part for guiding the one end of each of the contact pieces to the inspection point, and an electrode-side holding part for guiding the other end of each of the contact pieces to the electrode part, and is characterized in that a protrusion amount of one of the contact pieces in contact with the inspection point on the wiring pattern conductively connected to the electronic component is larger than a protrusion amount of the other of the contact pieces.
申请公布号 JP2014235112(A) 申请公布日期 2014.12.15
申请号 JP20130117746 申请日期 2013.06.04
申请人 NIDEC-READ CORP 发明人 MATSUOKA SHINJI
分类号 G01R1/073;H05K3/00 主分类号 G01R1/073
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