发明名称 FILM DEPOSITION APPARATUS
摘要 <p>PROBLEM TO BE SOLVED: To provide a film deposition apparatus that can have a target quickly replaced without opening a film deposition chamber to the atmosphere, and is adaptive to a large-area thin film and a long tape type thin film.SOLUTION: A film deposition apparatus which performs film deposition in a PLD method includes a mount member which is provided so as to mount a target for film deposition on an irradiation part for laser light, and has its mount surface inclined so that the target for film deposition slides in a naturally mounted state; a stopper which supports the target for film deposition to prevent the target for film deposition from slipping off the mount surface; a stopper release mechanism which releases the target for film deposition from being supported by the stopper; and supply means of supplying a preliminary target to the mount surface. The stopper release mechanism is placed in operation to make the target for film deposition mounted on the mount surface and supported by the stopper slip off, and the preliminary target is supplied to the mount surface by the supply means and supported by the stopper to achieve target replacement.</p>
申请公布号 JP2014234519(A) 申请公布日期 2014.12.15
申请号 JP20130114584 申请日期 2013.05.30
申请人 TOKYO INSTITUTE OF TECHNOLOGY;INTERNATIONAL SUPERCONDUCTIVITY TECHNOLOGY CENTER 发明人 ADACHI SEIJI;ISHIMARU YOSHIYASU;TANABE KEIICHI;HOSONO HIDEO
分类号 C23C14/24 主分类号 C23C14/24
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