| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for an upper unit for a semiconductor device, whereby deformation of an upper support (lid body) composing the upper unit is prevented, displacement with respect to a sensor chip is also prevented, and the semiconductor can be manufactured comparatively easily at a low cost.SOLUTION: A manufacturing method for an upper unit 12 connected to a lower unit 11 having a sensor chip 16 comprises: a first step of die-cutting a hold frame 18 from a conductive panel, the hold frame 18 including: a ceiling part 17 having in the center a small hole 21 composing part of a through-hole 21a, and extending so as to surround the area of the sensor chip 16 in a plane view; and a plurality of pillar parts 25 provided around the ceiling part 17 and defining the outline of a space part 27 by being bent, and having an abutting part 26 at the lower end thereof. The method further comprises: a second step of bending the pillar parts 25 around the ceiling part 17, and the abutting part 26; and a third step of inserting the hold frame 18 into a molding die, sealing it with resin, and exposing the abutting part 26, thereby forming the through-hole 21a. |
