发明名称 |
MANUFACTURING METHOD OF POLISHING HEAD AND POLISHING DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a polishing head capable of polishing a work of high flatness.SOLUTION: A polishing head 2 is provided with a packing pad 12 installed in a lower part of a rigid body 6 and holding a reverse surface of a work W and a ring-like template 13 for holding an edge part of the work W on an under surface of the packing pad 12, and polishes a surface of the work W by slidably contacting with polishing cloth 4 stuck on a surface plate 3 while holding the reverse surface of the work W by the under surface of the packing pad 12. The manufacturing method of the polishing head 2 comprises a packing pad adhesion process of adhering by a double-sided adhesive tape 16 to a lower part of the rigid body 6 under pressure reduction without heating the packing pad 12 and a template adhesion process of adhering to the packing pad 12 by the double-sided adhesive tape or a reaction-curable solventless liquid or pasty adhesive 21 under pressure reduction without heating the template 13 after the packing pad adhesion process. |
申请公布号 |
JP2014233815(A) |
申请公布日期 |
2014.12.15 |
申请号 |
JP20130118245 |
申请日期 |
2013.06.04 |
申请人 |
SHIN ETSU HANDOTAI CO LTD;SHIN-ETSU ENGINEERING CO LTD |
发明人 |
HASHIMOTO HIROMASA;ARIGA YASUHARU;SASAKI MASANAO;MATSUDA TAKAHIRO |
分类号 |
B24B37/30;H01L21/304 |
主分类号 |
B24B37/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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