发明名称 MANUFACTURING METHOD OF POLISHING HEAD AND POLISHING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method of a polishing head capable of polishing a work of high flatness.SOLUTION: A polishing head 2 is provided with a packing pad 12 installed in a lower part of a rigid body 6 and holding a reverse surface of a work W and a ring-like template 13 for holding an edge part of the work W on an under surface of the packing pad 12, and polishes a surface of the work W by slidably contacting with polishing cloth 4 stuck on a surface plate 3 while holding the reverse surface of the work W by the under surface of the packing pad 12. The manufacturing method of the polishing head 2 comprises a packing pad adhesion process of adhering by a double-sided adhesive tape 16 to a lower part of the rigid body 6 under pressure reduction without heating the packing pad 12 and a template adhesion process of adhering to the packing pad 12 by the double-sided adhesive tape or a reaction-curable solventless liquid or pasty adhesive 21 under pressure reduction without heating the template 13 after the packing pad adhesion process.
申请公布号 JP2014233815(A) 申请公布日期 2014.12.15
申请号 JP20130118245 申请日期 2013.06.04
申请人 SHIN ETSU HANDOTAI CO LTD;SHIN-ETSU ENGINEERING CO LTD 发明人 HASHIMOTO HIROMASA;ARIGA YASUHARU;SASAKI MASANAO;MATSUDA TAKAHIRO
分类号 B24B37/30;H01L21/304 主分类号 B24B37/30
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