| 摘要 |
PROBLEM TO BE SOLVED: To improve heat dissipation capability by bringing into contact with a heat dissipation object.SOLUTION: There is provided a heat dissipation resin molded body obtained by molding a resin composition containing polyphenylene sulfide as an organic synthetic resin, boron nitride as a thermally conductive filler, a glass fiber as a reinforced fiber and basic magnesium sulfate as an inorganic short fiber, The molded body has a surface roughness of less than 6 μm in terms of ten point average roughness and an excellent surface smoothness because basic magnesium sulfate is blended, and thus the adhesion with a heat dissipation object is enhanced and the heat dissipation capability for dissipating the heat of the heat dissipation object is increased. |
