SEMICONDUCTOR CHIP JUNCTION DEVICE AND SEMICONDUCTOR CHIP JUNCTION METHOD

摘要

PROBLEM TO BE SOLVED: To improve mounting accuracy and mounting quality of a semiconductor chip joined to a multi-piece forming substrate.SOLUTION: A semiconductor chip junction device includes: a temporary junction part which temporarily joins a semiconductor chip to a predetermined area of a multi-piece forming substrate; a permanent press-bonding part which permanently crimps the semiconductor chip temporarily joined to the predetermined area to the substrate in a batch; and a substrate transporting part which transports the substrate having the semiconductor chip temporarily joined thereto to the permanent press-bonding part and transports the substrate having the semiconductor chip permanently crimped thereto to the temporary junction part.