| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device and a semiconductor device manufacturing method, which can inhibit accumulation of cutting scraps of a solder layer in a recess and form a solder fillet having an intended shape.SOLUTION: A semiconductor device SD1 comprises: a lead L1 where a recess CP1 is formed across from under a tip surface to a rear face of the lead; a solder layer SDL2 formed at least on the rear face of the lead L1; and a solder layer SDL1 formed in the recess CP1, in which a thickness of the solder layer SDL1 in the recess CP1 is thicker than a thickness of the solder layer SDL2 on the rear face of the lead L1.</p> |
