| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrostatic chuck device in which a planar sample has no risk of deformation when it is attracted or detached, temperature of the planar sample is made uniform, and yet particles are less likely to be generated.SOLUTION: In an electrostatic chuck device having a mounting plate 11 the upper surface 11a of which serves as a mounting surface for mounting a planar sample W such as a semiconductor wafer, a support plate 12 integrated with the mounting plate 11, and an internal electrode 13 for electrostatic attraction and an insulating material layer 14 provided between the mounting plate 11 and the support plate 12, an annular protrusion 21 is provided at the peripheral part of the upper surface 11a, a plurality of protrusions 22 of the same height as the annular protrusion 21 are provided in a region surrounded by the annular protrusion 21 of the upper surface 11a, and the upper end each of the plurality of protrusions 22 is located on a concave surface 23 having the central part of the upper surface 11a as the central part. |
