| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a multilayer wiring board having high reliability, which includes a laminate preventing warpage and deformation at a low cost.SOLUTION: An in-plane insulation pattern 300 for contraction suppression is formed in a region overlapping, in a plane view, with a formation range of an in-plane conductive pattern 201 which is contracted when a lamination 100 is baked. The in-plane insulation pattern 300 is formed in a region opposed to a region where the in-plane conductive pattern 201 is formed while sandwiching a plane S passing through the lamination 100. The in-plane insulation pattern 201 for contraction suppression formed by an insulation paste prevents the in-plane conductive pattern 201 from short-circuiting between layers and eliminates formation of the useless conductive pattern using the conductive paste containing Cu, Ag or the like. Therefore, a multilayer wiring substrate 10 which includes the lamination 100 preventing warpage and deformation and has high reliability at a low cost.</p> |
