| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor module capable of reducing an increase in electric resistance or inductance of a wiring caused by a skin effect.SOLUTION: A semiconductor module 1 according to one embodiment comprises: a substrate 10 having insulation; a first wiring 40 and a second wiring 50 formed on the substrate; and a plurality of semiconductor chips 20 (and 30) for a power device including a first electrode 21 (31) connected to the first wiring 40 and a second electrode 22 (32) connected to the second wiring 50. At least one of the first wiring 40 and the second wiring 50 includes a groove along a current direction or is divided in a width direction crossing the current direction. |
