| 摘要 |
PROBLEM TO BE SOLVED: To provide a thin type glass ceramic multilayered wiring board excellent in board strength, capable of stably mounting a various electronic components, such as an IC, thereon, and corresponding to the lower profile of various modules.SOLUTION: A glass ceramic multilayered wiring board is characterized in that a first aspect ratio indicating a degree of oblateness/sphericity of fillers for exterior included in an outer insulation layer is larger than a second aspect ratio indicating that of fillers for interior included in an inner insulation layer, and a thermal expansion coefficient of the outer insulation layer is smaller than that of the inner insulation layer. |
