| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin applying device and resin applying method, which make it possible to improve production yield by hindering variation in an amount of resin applied, resulting from an abnormal state of a discharge nozzle, thereby making the light emission characteristics of the LED package uniform.SOLUTION: In the manufacture of an LED package in which an LED element is covered with resin 8 containing fluorescence substance, it is determined at predetermined timing set in advance in a measurement coating process or production coating process whether the resin 8 is in abnormal state or not based on a nozzle side image acquired by imaging, from a side with a camera 49, the lower end part of a discharge nozzle 33a, from which the resin 8 is discharged. An appropriate amount of resin to be applied, derived based on the measurement result of the light emission characteristics of the resin 8 applied as a test, is sent to a coating control section 36 for command. Also, based on the result of the determination of the presence/absence of the abnormal state, the LED element is coated with an appropriate amount of the resin 8 to be applied, thus performing the production coating process. |
