发明名称 THIN FILM FORMATION METHOD AND THIN FILM FORMATION APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a formation method of a thin film which is less likely to be peeled, by hardening a thin film material sufficiently down to a deep part.SOLUTION: A liquid film is formed on a substrate by coating the substrate with a photocurable liquid thin film material, and a film element is formed by irradiating the liquid film with temporary curing light, thereby hardening the liquid film temporarily. The procedure for forming the film element is repeated a plurality of times, thus laminating a plurality of film elements. Thereafter, the plurality of film elements are subjected to main hardening by being irradiated with main curing light. When repeating the procedure for forming the film element, intensity of the temporary curing light for forming a film element of relatively lower layers is set higher than the intensity of the temporary curing light for forming a film element of relatively upper layers.
申请公布号 JP2014236169(A) 申请公布日期 2014.12.15
申请号 JP20130118406 申请日期 2013.06.05
申请人 SUMITOMO HEAVY IND LTD 发明人 OKAMOTO YUJI
分类号 H05K3/28;B05C5/00;B05C9/12;B05D1/38;B05D3/06 主分类号 H05K3/28
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