发明名称 LED PACKAGE AND METHOD OF MANUFACTURING LED PACKAGE
摘要 PROBLEM TO BE SOLVED: To provide an LED package that costs less to manufacture.SOLUTION: The LED package mounted with a plurality of LED elements includes: a conductive pattern formed of a metal plate by press working and having a plurality of first mounting portions and second mounting portions; insulators having holding portions attached around the plurality of first mounting portions and second mounting portions, respectively, to hold the conductive pattern; anisotropic conductive members connected to the first mounting portions and second mounting portions at the plurality of first mounting portions and second mounting portions, respectively; and the LED elements connected to the first mounting portions and second mounting portions via the anisotropic conductive members. The conductive pattern further has parting portions parted after the insulators have been attached.
申请公布号 JP2014236173(A) 申请公布日期 2014.12.15
申请号 JP20130118469 申请日期 2013.06.05
申请人 DENOV COMPANY LTD 发明人 KATO NOBUKAZU;HAYASHI KOJI
分类号 H01L33/62;H01L33/50;H01L33/56;H01L33/60;H01L33/64 主分类号 H01L33/62
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