| 摘要 |
PROBLEM TO BE SOLVED: To improve the reliability of a semiconductor device.SOLUTION: A semiconductor device PKG comprises: an insulative substrate BS having a through hole SH; a terminal TE formed on a lower surface BSb of the substrate BS; and a semiconductor chip CP that is mounted face-up on an upper surface BSa of the substrate. Further, the semiconductor device comprises: a conductive member such as a wire BW electrically connecting an exposed surface EX of the terminal TE, which is exposed from the through hole SH of the substrate BS, to a pad PD of the semiconductor chip CP; and a sealing body MR for sealing the conductive member, an inside of the through hole SH in the substrate BS, and the semiconductor chip CP. The exposed surface EX of the terminal TE exposed from the through hole SH of the substrate BS is provided with anchor means in a region other than a joint portion to which the conductive member such as the wire BW is joined. |
