WIRING STRUCTURE AND FORMATION METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To improve the high frequency characteristics compared with the wiring structure by a conventional plating method.SOLUTION: A wiring structure includes a first metal layer 2 becoming a seed layer formed on an interlayer insulating film 1, and a second metal layer 3 formed on the first metal layer 2 and interlayer insulating film 1 so as to cover the first metal layer 2. The width of the second metal layer 3 is wider than that of the first metal layer 2, and the conductivity of the second metal layer 3 is higher than that of the first metal layer 2.