发明名称 PLATING DEVICE FOR NICKEL PLATING
摘要 <p>PROBLEM TO BE SOLVED: To improve the productivity of a nickel plating operation while maintaining sufficient nickel plating quality.SOLUTION: Provided is a plating tank 10 in which nickel plating is applied to the body W to be plated, containing: an anode chamber 12 including an anode 18 dipped into a plating liquid A; a cathode chamber 14 including the body W to be plated to be made into a cathode and dipped into the plating liquid A; and a first diaphragm 16 dividing the anode chamber 12 and the cathode chamber 14, and the plating liquid A is moved from the side of the cathode chamber 14 to the side of the anode chamber 12 by feeding the plating liquid A from the outside of the tank to the cathode 14 and exhausting the same from the anode chamber 12 to the outside of the tank.</p>
申请公布号 JP2014234538(A) 申请公布日期 2014.12.15
申请号 JP20130116902 申请日期 2013.06.03
申请人 MURATA:KK 发明人 MATSUZAKI SHINYA;KATO KAZUHIKO;MICHIGAMI SHOJI
分类号 C25D17/00;C25D21/00;C25D21/12;C25D21/18 主分类号 C25D17/00
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