发明名称 |
PLATING DEVICE FOR NICKEL PLATING |
摘要 |
<p>PROBLEM TO BE SOLVED: To improve the productivity of a nickel plating operation while maintaining sufficient nickel plating quality.SOLUTION: Provided is a plating tank 10 in which nickel plating is applied to the body W to be plated, containing: an anode chamber 12 including an anode 18 dipped into a plating liquid A; a cathode chamber 14 including the body W to be plated to be made into a cathode and dipped into the plating liquid A; and a first diaphragm 16 dividing the anode chamber 12 and the cathode chamber 14, and the plating liquid A is moved from the side of the cathode chamber 14 to the side of the anode chamber 12 by feeding the plating liquid A from the outside of the tank to the cathode 14 and exhausting the same from the anode chamber 12 to the outside of the tank.</p> |
申请公布号 |
JP2014234538(A) |
申请公布日期 |
2014.12.15 |
申请号 |
JP20130116902 |
申请日期 |
2013.06.03 |
申请人 |
MURATA:KK |
发明人 |
MATSUZAKI SHINYA;KATO KAZUHIKO;MICHIGAMI SHOJI |
分类号 |
C25D17/00;C25D21/00;C25D21/12;C25D21/18 |
主分类号 |
C25D17/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|