| 摘要 |
<p>PROBLEM TO BE SOLVED: To solve such a problem that in a step for fixing a semiconductor device to a heat dissipation fin, there is a risk of excessive human or mechanical pressing of a fixture, and in the case of conventional semiconductor device, when a pressure load from the pressing part of the fixture is applied to the bottom of a recess, an excessive pressure load is transmitted to a semiconductor element built in a sealing resin, thus possibly causing occurrence of characteristic variation or cracking of the semiconductor element.SOLUTION: A semiconductor device in which an excessive pressure load is not applied to a mounted semiconductor element, even if a fixture is pressed strongly when fixing the semiconductor device by using a strip fixture, can be provided.</p> |
