METHOD FOR MANUFACTURE OF FINE LINE CIRCUITRY

摘要

The present invention relates to a method for manufacture of fine line circuitry in the manufacture of printed circuit boards, IC substrates and the like. The method utilizes a first conductive layer (10) on the smooth surface of a build-up layer (1) and a second conductive layer (11) selected from electrically conductive polymers, colloidal noble metals and electrically conductive carbon particles on the roughened walls of at least one opening which are formed after depositing the first conductive layer.