| 摘要 |
<p>The present invention provides a substrate test device capable of preventing damage to electronic components integrated on a substrate of a test target and a related technology. The substrate test device for performing electric testing of a wiring pattern formed on a substrate (90) integrated with electronic components (95) includes: a plurality of contact makers (12); a switch circuit (20); and a controller (30). The controller (30) applies a voltage by a power supply (31) between one contact maker (12a) and another contact maker (12h) to test the insulation status between two wiring patterns (PT1, PT2) corresponding to two test points (93a, 93h) on the substrate. At the time, when a forward bias is applied to diodes (21a, 22h) which are inserted between the two contact makers (12a, 12h) outside the substrate and current flows in the forward direction, the potential difference between the two becomes the same as the potential difference between the two ends of the diodes (21a, 22h), being limited to a relatively small value (VL2).</p> |
