| 摘要 |
<p>The invention concerns a method for forming a metal network on the surface of a transparent substrate, comprising (a) supplying a transparent substrate with at least one hydrophilic surface having a surface energy such that the contact angle of a drop of water is less than 40°, (b) printing a hydrophobic layer of molecules on said hydrophilic surface, resulting in an increase in the contact angle of a drop of water by at least 90°, said hydrophobic layer being divided into a plurality of non-contiguous hydrophobic domains delimited by a continuous hydrophilic network not covered by the hydrophobic layer; and (c) bringing the substrate obtained in this way into contact with an aqueous electroplating solution containing at least one metal salt and at least one reducing agent of said metal, in such a way as to form a continuous metal network on the continuous hydrophilic network, (d) mechanically treating the electroplated substrate, so as to remove the metal layer selectively from the non-contiguous hydrophobic domains.</p> |
