IN-LINE AUTO PCB BONDING APPARATUS

摘要

The present invention includes: a first supply line unit which is formed to be able to transfer a panel in an X-axis direction by loading the panel from all processes in order to automate all processes for bonding a PCB to the mounting position of the panel after uniformly supplying the panel and the PCB respectively in order, respectively and precisely align in the process of supplying the panel and the PCB, and provide the bonded PCB to the accurate mounting position of the panel by fixating the panel in a pre-compression; a second supply line unit which is positioned at a distance from the first supply line unit, is formed to transfer a PCB in an X-axis direction by loading the PCB, and is formed to be able to attach an anisotropic conductive film to the PCB; and a main bonding unit which is positioned between the first supply line unit and the second supply line unit and is formed to be able to compress the PCB transferred from the second supply line unit on the panel transferred by the first supply line unit. The main bonding unit includes: a stage unit which is formed to support to position a panel and a PCB respectively supplied by the first supply line unit and the second supply line unit and enables the panel and the PCB to be movable back and forth in a mutually corresponding Y-axis direction; and a bonding unit which compresses the PCB to the panel supplied by the stage unit by adding a pressure.