Optical Die Test Interface

摘要

An integrated circuit optical die test interface and associated testing method are described for using scribe area optical mirror structures (106) to perform wafer die tests on MEMS optical beam waveguide (112) and optical circuit elements (113) by perpendicularly deflecting optical test signals (122) from the scribe area optical mirror structures (106) into and out of the plane of the integrated circuit die under test (104) and/or production test die (157).

主权项

1. A method comprising:
providing a wafer comprising a first die and a scribe grid surrounding the first die, the first die comprising a first optical waveguide beam located in a first structure at a peripheral die edge of the first die, and the scribe grid comprising an optical deflection mirror for perpendicularly deflecting optical signals located in a second structure proximate to the peripheral die edge of the first die; forming a recess opening in the scribe grid of the wafer to reveal at least the first waveguide beam; and performing one or more optical wafer die tests on the first die using at least a first optical signal that is received in a first plane that is perpendicular to a lateral plane of the wafer and perpendicularly deflected at the optical deflection mirror into the lateral plane of the wafer for transmission across the recess opening for reception at the first optical waveguide beam.