| 发明名称 |
FLEXIBLE STACK PACKAGES, ELECTRONIC SYSTEMS INCLUDING THE SAME, AND MEMORY CARDS INCLUDING THE SAME |
| 摘要 |
Flexible stack packages are provided. The flexible stack package includes a first unit package and a second unit package which are sequentially stacked. Each of the first and second unit packages has a fixed area and a floating area. The fixed area of the first unit package is connected and fixed to the fixed area of the second unit package by a fixing part. |
| 申请公布号 |
US2014361427(A1) |
申请公布日期 |
2014.12.11 |
| 申请号 |
US201314081020 |
申请日期 |
2013.11.15 |
| 申请人 |
SK hynix Inc. |
发明人 |
KIM Jong Hoon |
| 分类号 |
H01L23/498 |
主分类号 |
H01L23/498 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A flexible stack package comprising:
a first unit package and a second unit package which are sequentially stacked, each of the first and second unit packages having a fixed area and a floating area; and a fixing part that connects and fixes each fixing part of the fixed areas of the first and second unit packages, wherein each of the first and second unit packages includes a lower flexible layer, an upper flexible layer on the lower flexible layer, and a chip between the lower and upper flexible layers. |
| 地址 |
Icheon-si Gyeonggi-do KR |
