发明名称 THERMALLY EXPANDABLE MICROCAPSULE AND MOLDED FOAM BODY
摘要 The present invention provides: a thermally expandable microcapsule that makes it possible to produce a molded foam body that has excellent heat resistance and a high expansion ratio, that does not easily turn yellow, and that has an excellent appearance; and a molded foam body that uses the thermally expandable microcapsule. The present invention is a thermally expandable microcapsule in which a volatile expansion agent is enclosed as a core agent in a shell that comprises a polymer. The shell comprises a polymer obtained by polymerizing a monomer composition comprising: 44-63 wt% of a polymerizable monomer (I) that is selected from at least one of acrylonitrile and methacrylonitrile; 15-30 wt% of a radical-polymerizable unsaturated carboxylic acid monomer (II) that has a carboxyl group and 3-8 carbon atoms; 0.1-3.0 wt% of a cross-linkable monomer (III) having two or more double bonds within the molecule thereof; and 21-40 wt% of a polymerizable monomer (IV) comprising at least one of a (meth)acrylic acid ester, vinylidene chloride, vinyl acetate, and a styrene-based monomer.
申请公布号 WO2014196625(A1) 申请公布日期 2014.12.11
申请号 WO2014JP65064 申请日期 2014.06.06
申请人 SEKISUI CHEMICAL CO., LTD. 发明人 MATSUKUBO TATSUYA;SASAKI YUUSAKU;ITOU DAICHI;NAKANO SHINYA;KAWAGUCHI YASUHIRO
分类号 C09K3/00;B01J13/02;C08J9/32 主分类号 C09K3/00
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