| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can fix leads more successfully and appropriately incorporate a plurality of electronic components at the same time.SOLUTION: A semiconductor device comprises: a substrate 1 including a base material 11 having a surface 111 and a rear face 112, and a wiring pattern 13 formed on the side of the surface 111 of the base material 11; a plurality of electronic components 2 mounted on the surface 111 of the substrate 1; and an encapsulation resin 4 which covers at least a part of the substrate and covers the plurality of electronic components 2. The wiring pattern 13 has a pad 131 and includes leads 3 each of which has a bonded part 31 which is covered with the encapsulation resin 4 and bonded to the pad 131, a terminal part 321 projecting from the encapsulation resin 4 and a retreat part 331 which lays between the bonded part 31 and the terminal part 321 and extends in a z direction so as to separate from the surface 111 of the substrate 1. |
