发明名称 PRINTED CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide a printed circuit board having a via hole with improved electrical connection reliability.SOLUTION: A printed circuit board includes: a first insulating layer 210; a pad 211 formed on the first insulating layer 210; a second insulating layer 220 covering the first insulating layer 210 having the pad 211 thereon; and a via hole 221 formed in the second insulating layer 220. The via hole 221 formed in the second insulating layer 220 has a bottom surface on the pad 211, which is a non-planar surface having an uneven shape.
申请公布号 JP2014232862(A) 申请公布日期 2014.12.11
申请号 JP20140023066 申请日期 2014.02.10
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 JANG DEOK SUK;LEE YONG SAM
分类号 H05K1/11;H05K3/00;H05K3/46 主分类号 H05K1/11
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