发明名称 |
PRINTED CIRCUIT BOARD |
摘要 |
PROBLEM TO BE SOLVED: To provide a printed circuit board having a via hole with improved electrical connection reliability.SOLUTION: A printed circuit board includes: a first insulating layer 210; a pad 211 formed on the first insulating layer 210; a second insulating layer 220 covering the first insulating layer 210 having the pad 211 thereon; and a via hole 221 formed in the second insulating layer 220. The via hole 221 formed in the second insulating layer 220 has a bottom surface on the pad 211, which is a non-planar surface having an uneven shape. |
申请公布号 |
JP2014232862(A) |
申请公布日期 |
2014.12.11 |
申请号 |
JP20140023066 |
申请日期 |
2014.02.10 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO LTD |
发明人 |
JANG DEOK SUK;LEE YONG SAM |
分类号 |
H05K1/11;H05K3/00;H05K3/46 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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