| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an inspection device that suppresses a decrease in inspection precision due to electrode waste.SOLUTION: An inspection device 1 is configured to perform inspection by bringing a tip of a probe 12 into contact with an inspection object plane W1 of a wafer W where a solid-state imaging element is formed, and includes a stage 11 for supporting the wafer W and a probe card 13 which is provided with a through hole 131 at its center part while a root of the probe 12 is fitted to a periphery of the through hole 131. When the inspection device 1 performs inspection, the stage 11 supports the wafer W so that the inspection object plane W1 of the wafer W is inclined to a horizontal plane, and light or a pattern for inspection is projected on the solid-state imaging element from a projection plane 141 opposed to the inspection object plane W1 of the wafer W through the through hole 131 of the probe card 13.</p> |
