| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent occurrence of cracks in a sealant layer.SOLUTION: It has been found that in a region of a sealant layer 3 in which region a thermal expansion amount is relatively large in a terminal protruding direction (hereinafter, "high thermal expansion region"), a sealant layer thickness t1 when a heat stress is applied (i.e., at a high temperature) is far larger than a sealant layer thickness t0 at a normal temperature. As a result, a stress of a region Z in contact with a terminal 4 and a sensor chip 2 is higher, resulting in occurrence of cracks. Considering these, a protrusion 12 is provided in a region of a case 1 which region overlaps the high thermal expansion region so as to make the sealant layer thinner in the high thermal expansion region and reduce the thermal expansion amount of the thermal expansion region in the terminal protruding direction. This can reduce the stress of the region Z in contact with the terminal 4 and the sensor chip 2 in the high thermal expansion region and prevent occurrence of cracks in the sealant layer 3.</p> |
