| 发明名称 |
COMPOUND SLOT |
| 摘要 |
The present disclosure describes a compound slot, and systems and methods of forming the compound slot. An example of a compound slot includes a wafer, where the compound slot includes a trench along a long axis of the compound slot and on a top surface of the wafer, where the trench passes through an initial portion of a total depth of the wafer. A number of openings pass through a remaining portion of the total depth of the wafer, where at least a retained portion of a bottom of the trench is present around a perimeter of each of the number of openings. |
| 申请公布号 |
US2014362146(A1) |
申请公布日期 |
2014.12.11 |
| 申请号 |
US201214376058 |
申请日期 |
2012.04.27 |
| 申请人 |
Ge Ning;Peh Bee Ling;Benjamin Trudy;Ng Ken Kiat;Gu Jianhui |
发明人 |
Ge Ning;Peh Bee Ling;Benjamin Trudy;Ng Ken Kiat;Gu Jianhui |
| 分类号 |
B41J2/175;B23K26/38;B41J2/16 |
主分类号 |
B41J2/175 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A compound slot, comprising:
a wafer, wherein the compound slot comprises:
a trench along a long axis of the compound slot and on a top surface of the wafer, wherein the trench passes through an initial portion of a total depth of the wafer; anda number of openings that pass through a remaining portion of the total depth of the wafer, wherein at least a retained portion of a bottom of the trench is present around a perimeter of each of the number of openings. |
| 地址 |
Singapore SG |
